1. An Assessment of Multilevel Converters Submodules EMI Emissions Considering Three Configurations Including Parasitic Parameters,
2023,
Amr Madi
,
Waseem Elsayed
,
Ahmed Hebala
,
Michał
Przybylski
,
Piotr
Leżyński
,
Robert
Smoleński
,
W:International Symposium and Exhibition on Electromagnetic Compatibility - EMC Europe 2023, Kraków, Polska, New York: IEEE Xplore, 2023, s. 1--5,
https://emceurope2023.org/#
Słowa kluczowe: Conducted emissions, Double clamped, Full bridge, Half bridge, IGBT, MOSFET, Multilevel converter, Submodule
Kod: KON-ANG
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